AiT CMT-SR5000 wafer sheet-resistance and resistivity mapping measurement system
AiT CMT-SR5000 wafer sheet-resistance and resistivity mapping measurement system

AiT CMT-SR5000 12-Inch Wafer Four-Point Probe Sheet Resistance and Resistivity Measurement System

The AiT CMT-SR5000, supplied by Fulcrum Technology, is a four-point probe system designed for sheet-resistance and resistivity measurements on 12-inch wafers. Paired with a high-stability probe from UK-based Jandel, it supports electrical testing of semiconductor wafers and applications involving diffusion, doping, thin-film deposition, conductive films, solar cells, materials research, and process quality control. The system can be evaluated according to wafer size, measurement locations, expected sheet-resistance and resistivity ranges, mapping requirements, data analysis needs, and the existing QC workflow. Its versatile mapping software helps review measurement distribution and uniformity across the wafer; thickness may also be assessed from electrical measurements when the required material parameters and conversion conditions are known. Confirm the suitable probe and platform configuration, measurable ranges, and data-output requirements against the actual sample and inspection purpose.

Key Features

CMT-SR5000 Sheet Resistance Measurement for 12-Inch Wafers and Large-Area Films

The CMT-SR5000 supports surface-resistance measurement for wafers, films, glass, solar materials, and conductive materials. It is suitable for R&D, process monitoring, and quality-control analysis. Confirm sample dimensions, material structure, measurement locations, and analysis requirements before implementation.

01

Supports 300 mm wafers and large samples

Designed for measurements on 300 mm wafers. Surface-resistance testing of large samples such as 210 × 1210 mm films and glass can also be evaluated according to application needs.

02

Multiple measurement units

Results can be displayed in ohm, ohm/sq, ohm·cm, and S to support data review across different materials and process conditions.

03

Standalone operation or computer control

Choose standalone operation or computer-software control for measurement, data organization, and subsequent analysis according to the workflow.

04

2D and 3D analysis maps

Analysis software can generate 2D contour maps or 3D plots from measurement data to help review electrical distribution and uniformity across wafers, films, or glass samples.

05

High-accuracy JANDEL probe head

The JANDEL probe head is a key configuration for contact-type surface- and sheet-resistance measurements. Confirm measurement conditions against the sample surface and inspection workflow.

Selection note: For 12-inch wafer sheet-resistance measurements or distribution analysis on large films and glass, confirm sample dimensions, expected resistance range, measurement locations, 2D/3D mapping needs, data export, and quality-control workflow.


Specification

CMT-SR5000 Sheet Resistance Measurement Specifications

These specifications provide an initial reference for surface-resistance measurements on 300 mm wafers, films, glass, and solar materials. Confirm actual measurement conditions according to sample dimensions, material structure, resistance range, measurement locations, and the quality-control workflow.

Specification itemCMT-SR5000 details
Measurement range1 mΩ/sq–2 MΩ/sq
Operating methodPlace the sample on the measurement stage and press the measurement key. The system automatically adjusts the range and displays the reading, decimal point, and multiplier.
JANDEL four-point probeEquipped with a JANDEL-designed quick-connect fitting/converter probe. No special tools or alignment fixture are required, and installation can be completed quickly. A JANDEL probe is included as standard.
Measurement data displayMeasurement data is displayed directly on the equipment's main-panel display.
Measurement speedApprox. 2 ± 1 seconds/point
Internal component accuracy±0.5% (high-precision resistor)
Maintenance and serviceMicroprocessor technology supports reliable operation. Electronic components are installed on replaceable printed circuit boards to facilitate maintenance and service evaluation.

Note: The information above is provided as a reference. Actual measurement performance depends on sample surface condition, contact conditions, probe configuration, measurement environment, and data-analysis requirements.

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